Overview
The 6 inch (150 mm) silicon carbide substrate from MinnOptics offers a balance of size, performance, and cost efficiency.
It is made from high-purity 4H-N type material, ideal for manufacturing power electronics, RF devices, and thermal control systems.
The wafer provides excellent heat conduction and mechanical durability for advanced semiconductor applications.
Main Features
High Thermal Conductivity
Silicon carbide moves heat quickly away from active areas.
This improves reliability and supports stable operation under high load.
Strong Electrical Properties
4H-SiC maintains a wide bandgap of 3.26 eV.
It handles high voltage and high temperature with low energy loss.
Excellent Mechanical Strength
The crystal structure offers hardness near 9 on the Mohs scale.
This ensures superior resistance to wear and processing damage.
Chemical and Thermal Stability
SiC resists corrosion, oxidation, and thermal shock.
It performs well in harsh or variable environments.
Precise and Consistent Quality
The wafer is processed with advanced polishing and inspection.
Low defect density and minimal warp improve device yield and performance.
Applications
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Power Electronics: IGBTs, MOSFETs, Schottky diodes, and power modules
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RF Devices: Amplifiers, microwave, and satellite communication components
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Electric Vehicles: Charging units, inverters, and motor controllers
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Industrial Systems: Smart grids, energy conversion, automation
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Aerospace and Defense: High-temperature, radiation-resistant electronics
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Research and Development: Wide bandgap material testing and device prototyping
Customization and Support
MinnOptics provides custom services for research and production users.
Options include orientation angle adjustment, surface finishing, and dopant control.
Each substrate is inspected with advanced metrology tools to ensure quality consistency.
Global technical support and logistics ensure safe and fast delivery.
Why Choose the 6 Inch SiC Substrate
The 6 inch format offers high performance with flexible production scale.
It fits both R&D and industrial mass production.
Its superior heat conduction, mechanical strength, and reliability make it a trusted choice for next-generation electronic systems.
Choosing this wafer helps you achieve efficiency, durability, and cost control.
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