Product Overview
12 inch FOUP is a specialized container for 300mm silicon wafers. We manufacture this carrier using PC+CF material. This stands for Polycarbonate and Carbon Fiber. This material ensures the box is conductive and strong. Our FOUP provides a safe environment for your wafers. It meets all standard SEMI specifications. It is compatible with standard AMHS and load ports in your fabrication plant.
Technical Specifications
- Product Name: 12 Inch FOUP / 300mm Wafer Carrier
- Material: Polycarbonate + Carbon Fiber (PC+CF)
- Capacity: 25 Wafers
- Wafer Diameter: 300mm
Cleanliness and Particle Control
We know that cleanliness is the most important factor for semiconductor yields. Even a microscopic particle can ruin a 12 inch wafer. Our product focuses on three key areas of cleanliness.
- Zero Particle Generation: Friction causes dust. Standard plastic is soft and creates dust when wafers slide in and out. Our PC+CF material is extremely hard and abrasion resistant. It does not generate particles during wafer insertion or removal. It keeps your processed wafers safe from contamination.
- Washability and Durability: You need to wash FOUPs frequently to maintain high yields. This cleaning process uses strong chemicals and Ultra Pure Water. Our PC+CF material is chemically resistant. It withstands frequent washing cycles without degrading. It does not peel or crack over time. This reduces your replacement costs.
- Low Outgassing: Some plastics release gases that form a haze on wafers. Our material has very low outgassing characteristics. It is safe for long term storage of sensitive wafers.
Common Questions (FAQ)
Q: What is a FOUP?
A: FOUP stands for Front Opening Unified Pod. It is the standard carrier for transporting 300mm wafers in a cleanroom. The door opens from the front. This design allows automated robots to access the wafers directly. It isolates the wafers from the cleanroom air to prevent contamination.
Q: What is the difference between FOUP and FOSB?
A: Customers often ask about the difference between FOUP and FOSB.
- FOUP: A FOUP is for internal transport. It stays inside the fab. It moves wafers between process tools. It requires very high precision for robots.
- FOSB: FOSB stands for Front Opening Shipping Box. It is for external transport. It is used to ship wafers from the wafer manufacturer to the device fab. It focuses on shock absorption during shipping.
Contact Us
We provide high quality FOUP solutions for semiconductor manufacturing. Please contact our sales team for a quote. We offer competitive pricing for bulk orders.
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